The International Engineering Fair in Brno, held from October 10 to October 13, 2023, was a momentous event in the world of engineering and industry. The magnificent stand Organized by the National Center of Industry 4.0 and the Czech Technical University in Prague, namely RICAIP Testbed for Industry 4.0, with valuable support from EIT Manufacturing and leading industrial partners such as T-Mobile, Siemens, Ceska sporitelna, Sick, and DEL, this fair showcased the future of manufacturing through flexible modular production and cutting-edge technologies.
At the heart of the stand was a remarkable demonstration: a two-robot Flexible modular manufacturing cell equipped with 5G and IoT technologies. This technological unique symbolized a significant leap into a new era of data-driven and digitalized production. The key message of the presentation was to foster a collaborative ecosystem between academic and commercial partners, all aimed at helping small and medium-sized enterprises (SMEs) with digitalization.
The fair’s success was a testament to the power of collaboration and innovation in shaping the future of manufacturing. By bringing together academic and industrial partners, this initiative not only showcased the technology of tomorrow but also the pathway for SMEs to embrace the digital age. The focus on supporting SMEs is particularly important, as these enterprises are the pillar of many economies and stand to benefit immensely from the advances in flexible modular production and digital technologies.